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A group of European countries led by the Netherlands sets the basic work of the European Chips Law 2.0 after the original group failed to achieve its goal of strengthening the semiconductor industry. Reuters. The group aims to make concrete proposals for the summer to work closely with the European Commission. Politicians referred to their work after the chips and chips makers from EC were asked to launch a follow -up 2023 Chips Law.
The group includes nine members of the European Union led by the Netherlands, including France, Germany, Italy and Spain, which already has semiconductor industries (except Spain, which focuses more on research and development activities). Dutch Economy Minister Dirk Bilgres explained that this group is preparing for a possible second -to -conducting financing package for the semiconductor industry, including small and medium -sized companies.
“We need to allocate money,” Belgres told Reuters. “Each of the private and public funds to pay the sector, also to ensure that the flowing effect occurs and the (small and medium) companies also benefit.”
The Frames Act 2023 program, which is currently under review, failed to achieve any important goals because it requires the European Commission to approve the projects funded by member states and EC (however most projects were funded by member states). The approval required by the European Commission, Member States and local authorities were very slow for the semiconductor industry. As a result, Intel and Wolfspeed have postponed the construction of major production facilities in Europe since the change of economic positions while waiting for their approvals. According to Beljaarts, this time is to be more selective and strategic in financing decisions.
Europe is strong in areas such as research and development as well as chip making tools (ASML, ASM International, Carl Zeiss SMT, Suss Microtec, etc.). However, only Intel makes chips using the advanced process technique in Ireland. Other European chip makers use excess contract.
Because of the interest in selling their most advanced tools and government financing, the makers of semiconductor production equipment called for EC to launch the second round of financing.
After gathering in Brussels with European lawmakers, ESIA and Semi Europe (organizations unify chips and chip’s chips) that they will officially deal with their suggestion to henna virkunen, a digital official in the European Commission. Half of the need for direct support in several areas outside the Burundian armed forces, including “design and manufacture of semiconductor, research and development, materials and equipment.”
More than ten companies joined the meeting. Among them are BOSCH, Infineon, NXP, StMicroelectronics, as well as ASML, ASM, Zeiss and Air Liquide equipment.
